Constant, resilient spring force locks the components into place and ensures maximum repeatability even after constant assembly and disassembly. This method allows for device replacement or design changes without having to re-work the board.
Providing superior thermal efficiencies while reducing component and assembly costs, the M Series is supplied as a standard part measuring 55mm in length by 38.6mm high. However, Ohmite can supply the extrusion in other lengths in order to accommodate custom designs involving more or fewer resistors or semiconductors as required.
Available in both degreased and black anodised finishes, the multi device heatsink is the latest in a new range of heatsinks from Ohmite.
Black Heatsinks Enhance Thermal Performance
Because heat is removed from a component in two principle ways, convection and radiation, Ohmite have investigated the latter with a view to fanless, power saving operation.
Radiation is an electromagnetic phenomenon generated when heat is removed from charged particles within atoms, so Ohmite applied Planck’s law of radiation which says “If the object is a black body in thermodynamic equilibrium, the radiation is termed black-body radiation. The emitted wave frequency of the black body thermal radiation is described by a probability distribution depending only on temperature”.
In situations where a fan is used, the heat removed via radiation is negligible compared to the heat removed through convection. Customers using forced air can marginally reduce costs by using the degreased, non anodized version.